Some of the more common construction materials for heat sinks are aluminum and copper.
Most efficient heat sink design.
In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.
Currently fins are used extensively and rods are also available however are more expensive.
Bonded fin heat sinks.
These designs are designed for thermal efficiency but contained by manufacturing process.
They are produced from a solid block of metal.
Ats engineers used analytical modeling and cfd simulations to examine the thermal performance of two aluminum heat sink designs.
These heat sinks offer high design flexibility and you can achieve high fin density.
Heat sinks produced through this method are normally made from copper.
Analysis demonstrated that the design with heat pipes running above the components kept junction temperatures within 2 c of the original.
For over a decade these parts have offered an alternative to the limitations of the extrusion process.
Bonded fin heat sinks generally offer moderate performance and come at a high cost.
Increases in cooling surface area of 200 to 300 allow significant decreases in heat sink volume.
A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature.
When designing a heat sink for a cpu cooler what is the optimal design.
3 skived heat sinks.
One with heat pipes that stopped at the edge of the components and the other with heat pipes that ran above the components.